First Demonstration of High-Density Interconnects Integrated with Ultra Density Optical Technology

Abstract

The performance requirements of interconnects to and on silicon chips, both now and in the future is analyzed in this paper. To determine what optoelectronic and optical components are needed if optics is to address the main connection issues for next-generation high-performance silicon processors, we compare optical and electrical interconnects. Potential advantages of optics include timing, energy, and link density. As the information sectors see exponential development in performance, engineers are currently dealing with some technical challenges. Inter-chip connection bottlenecks are among the most critical problems. A novel "Photonics-Electronics Convergence System" idea is put forth by us. This technology allowed for the first demonstration of high-density optical connects integrated with a silicon optical waveguide, germanium photodetectors, silicon optical modulators, and a 13-channel arrayed laser diode on a single silicon substrate. Focusing on the optical transport and switching layer, we discuss elements of large-scale spatial multiplexing, vast optoelectronic arrays, and holistic optics-electronics-DSP integration, as well as optical node topologies for switching and multiplexing of spatial and spectral super-channels.